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Brad Price
CPS Team Lead (Chip Placement Solution Team Lead)
Summary
Highly experienced and skilled CPS Team Lead (Chip Placement Solution Team Lead) with a proven track record of leading and managing all aspects of chip placement operations. Expertise in Surface Mount Technology (SMT), chip placement processes, machine vision and inspection techniques, pick-and-place equipment operation, troubleshooting, and problem-solving. Demonstrated ability to optimize production output, minimize downtime, and implement process improvements to increase efficiency. Strong leadership skills and a commitment to maintaining a high-performing team environment.
Education
Bachelor’s Degree in Electrical Engineering
January 2015
Skills
- Advanced Knowledge of Surface Mount Technology (SMT)
- Extensive Understanding of Chip Placement Processes
- Proficient in Machine Vision and Inspection Techniques
- Expertise in Pick-and-Place Equipment Operation
- Strong Troubleshooting and Problem-Solving Abilities
- In-Depth Knowledge of Printed Circuit Board (PCB) Assembly
Work Experience
CPS Team Lead (Chip Placement Solution Team Lead)
- Collaborated with design engineers to optimize chip placement accuracy and reliability
- Trained and mentored junior engineers, fostering a highperforming team environment
- Managed inventory and procured materials, ensuring adequate supply for production
- Adhered to strict quality control standards and maintained a clean and organized work area
CPS Team Lead (Chip Placement Solution Team Lead)
- Oversaw a department of 10+ engineers and technicians, leading all aspects of chip placement operations
- Managed multiple chip placement machines simultaneously, optimizing production output and minimizing downtime
- Developed and implemented process improvements that reduced production lead times by 15%
- Troubleshooted and resolved complex machine issues, minimizing production disruptions
Accomplishments
- Led a crossfunctional team in developing and implementing a new automated chip placement system, resulting in a 20% increase in production efficiency.
- Established and implemented a comprehensive quality assurance program, reducing product defects by 15% and enhancing customer satisfaction.
- Successfully led a project to upgrade the companys CPS software, improving system reliability and reducing downtime by 30%.
- Implemented a lean manufacturing initiative that streamlined production processes and reduced waste by 10%.
- Led a team in developing a new chip placement head that increased placement speed by 25%.
Awards
- Received the Chip Placement Solution Excellence Award for outstanding leadership and innovation in CPS technology implementation.
- Recognized as Top Team Leader for consistently exceeding performance targets and fostering a highperforming work environment.
- Awarded the Excellence in Customer Service Award for resolving complex technical issues and consistently exceeding customer expectations.
- Received the Innovation Award for developing a new process that optimizes chip placement accuracy, leading to a 5% reduction in assembly costs.
Certificates
- Certified SMT Process Engineer (CSMTPE)
- Certified IPC Specialist (CIS)
- Six Sigma Green Belt
- AS9100 Certified
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How To Write Resume For CPS Team Lead (Chip Placement Solution Team Lead)
- Highlight your technical expertise: Emphasize your in-depth knowledge of SMT, chip placement processes, and related technologies.
- Quantify your accomplishments: Use specific metrics and data to demonstrate the impact of your contributions, such as reducing production lead times or increasing production output.
- Showcase your leadership skills: Describe your experience managing and motivating a team, resolving conflicts, and fostering a positive work environment.
- Tailor your resume to the job description: Carefully review the job description and tailor your resume to highlight the skills and experience that are most relevant to the position.
Essential Experience Highlights for a Strong CPS Team Lead (Chip Placement Solution Team Lead) Resume
- Oversaw a department of 10+ engineers and technicians, providing leadership and guidance on all aspects of chip placement operations.
- Managed multiple chip placement machines simultaneously, optimizing production output and minimizing downtime.
- Developed and implemented process improvements that reduced production lead times by 15%, resulting in increased productivity and cost savings.
- Troubleshooted and resolved complex machine issues, minimizing production disruptions and ensuring smooth operations.
- Collaborated with design engineers to optimize chip placement accuracy and reliability, ensuring the highest quality standards.
- Trained and mentored junior engineers, fostering a high-performing team environment and promoting professional development.
- Managed inventory and procured materials, ensuring adequate supply for production and minimizing disruptions.
Frequently Asked Questions (FAQ’s) For CPS Team Lead (Chip Placement Solution Team Lead)
What are the key responsibilities of a CPS Team Lead (Chip Placement Solution Team Lead)?
The key responsibilities of a CPS Team Lead (Chip Placement Solution Team Lead) include overseeing chip placement operations, optimizing production output, minimizing downtime, implementing process improvements, troubleshooting machine issues, collaborating with design engineers, training and mentoring junior engineers, and managing inventory.
What are the essential skills and qualifications for a CPS Team Lead (Chip Placement Solution Team Lead)?
Essential skills and qualifications for a CPS Team Lead (Chip Placement Solution Team Lead) include advanced knowledge of SMT, extensive understanding of chip placement processes, proficiency in machine vision and inspection techniques, expertise in pick-and-place equipment operation, strong troubleshooting and problem-solving abilities, in-depth knowledge of PCB assembly, and excellent leadership and communication skills.
What are the career prospects for a CPS Team Lead (Chip Placement Solution Team Lead)?
CPS Team Leads (Chip Placement Solution Team Leads) with strong performance and leadership skills can advance to roles such as Production Manager, Operations Manager, or Engineering Manager within the electronics manufacturing industry. They may also pursue specialized roles in areas such as quality control, process engineering, or product development.
What are the challenges faced by CPS Team Leads (Chip Placement Solution Team Leads)?
CPS Team Leads (Chip Placement Solution Team Leads) may face challenges related to meeting production targets, ensuring product quality, managing a team effectively, staying updated with technological advancements, and optimizing processes to improve efficiency and reduce costs.
What are the key trends and innovations in the field of Chip Placement Technology?
Key trends and innovations in the field of Chip Placement Technology include the adoption of advanced machine vision systems, increased automation, the use of AI and machine learning for process optimization, the development of new materials and adhesives, and the miniaturization of electronic components.
What are the professional organizations and certifications relevant to CPS Team Leads (Chip Placement Solution Team Leads)?
Relevant professional organizations and certifications for CPS Team Leads (Chip Placement Solution Team Leads) include the Surface Mount Technology Association (SMTA), the Institute for Printed Circuits (IPC), and certifications such as the Certified SMT Process Engineer (CSMTPE) and the Certified IPC Specialist (CIS).
What are the typical salary expectations for CPS Team Leads (Chip Placement Solution Team Leads)?
Salary expectations for CPS Team Leads (Chip Placement Solution Team Leads) can vary depending on experience, qualifications, location, and company size. According to industry data, the average salary range for CPS Team Leads in the United States is between $70,000 and $120,000 per year.
What is the job outlook for CPS Team Leads (Chip Placement Solution Team Leads)?
The job outlook for CPS Team Leads (Chip Placement Solution Team Leads) is expected to be positive due to the increasing demand for electronic devices and the growing adoption of SMT technology. The aging workforce and the need for skilled professionals in this field also contribute to a favorable job outlook.